Analysis of Mode I Dynamic Crack Tip Singular Stress Fields for MEMS Structural Design
Author:
Affiliation:
1. College of Science and Engineering, Ritsumeikan University
Publisher
Institute of Electrical Engineers of Japan (IEE Japan)
Link
https://www.jstage.jst.go.jp/article/ieejsmas/144/6/144_123/_pdf
Reference23 articles.
1. (1) A. A. Barlian, W.-T. Park, J. R. Mallon, A. J. Rastegar, and B. L. Pruitt : “Review: Semiconductor piezoresistance for microsystems”, Proceedings of the IEEE, Vol. 97, No. 3, pp. 513-552 (2009)
2. (2) H. Phan, D. V. Dao, K. Nakamura, S. Dimitrijev, and N. Nguyen : “The piezoresistive effect of SiC for MEMS sensors at high temperatures: A Review”, Journal of Microelectromechanical Systems, Vol. 24, pp. 1663-1677 (2015)
3. (3) M. Mehregany, L. Tong, L. Matus, and D. Larkin : “Internal stress and elastic modulus measurements on micromachined 3C-SiC thin films”, IEEE Transactions on Electron Devices, Vol. 44, pp. 74-79 (1997)
4. (4) T. Mura : “Micromechanics of Defects in Solids”, Second, Revised edition, Kluwer Academic Publishers (1987)
5. (5) L. B. Freund : “Dynamic fracture mechanics”, Cambridge University Press (1990)
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