Micro Connector for High Packaging Density Fabricated by Using UV Thick Photoresist-Reference-Cited by-同舟云学术

Micro Connector for High Packaging Density Fabricated by Using UV Thick Photoresist

Published:2002 Issue:5 Volume:122 Page:249-255
ISSN:1341-8939
Container-title:IEEJ Transactions on Sensors and Micromachines
language:en
Short-container-title:IEEJ Trans. SM

Author:

Unno Toshinori¹,Toriyama Toshiyuki²,Bhuiyan Moinul Islam¹,Yokoyama Yoshihiko¹,Sugiyama Susumu¹

Affiliation:

1. Ritsumeikan University

2. New Energy and Industrial Technology Development Organization

Publisher

Institute of Electrical Engineers of Japan (IEE Japan)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

https://www.jstage.jst.go.jp/article/ieejsmas/122/5/122_5_249/_pdf

Reference7 articles.

1. [2] F. Michel and W. Ehrfeld: “Mechatronic Micro Devices”, Proceedings of the 1999 International Symposium on Micromechatronics and Human Science, pp. 27-32, 1999.

2. [3] D.C. Miller, W. Zhang and V.M. Bright: “Microrelay Packaging Technology Using Flip-Chip Assembly”, Proceedings of MEMS 2000, pp. 265-270, 2000.

3. [4] H. Okuyama, T. Haga, K. Emura, and H. Takada, “Development of Microconnector with Automatic Connecting/Disconnecting Mechanism”, Proceeding of MEMS 1999, pp. 257-262, 1999.

4. [5] W.N. Sharpe Jr., D.A. Lavan and Richard L. Edwards, “Mechanical Properties of LIGA-Deposited Nichel for MEMS Transducers”, Digest of Technical Paper of TRANSDUCERS’97, Vol. 1, pp. 607-610, 1997.

5. [6] JSR Photoresist Product for Thick Layer Process, JSR Corporation (1999).

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