100 m-level Spiral Silicon Micro-Trenches with 3-Step Smooth Sidewalls to Deposit Superconducting Material for Miniaturized Magnetic Energy Storage
Author:
Affiliation:
1. Toyota Technological Institute
2. Materials and Surface Engineering Research Institute, Kanto Gakuin University
3. Institutes of Innovation for Future Society, Nagoya University
Publisher
Institute of Electrical Engineers of Japan (IEE Japan)
Subject
Electrical and Electronic Engineering,Mechanical Engineering
Link
https://www.jstage.jst.go.jp/article/ieejsmas/142/5/142_78/_pdf
Reference21 articles.
1. (1) M. H. Ali, B. Wu, and R. A. Dougal : “An Overview of SMES Applications in Power and Energy Systems”, IEEE Trans. Sustainable Energy, Vol. 1, No. 1, pp. 38-47 (2010)
2. (2) 江本邦幹・奥山憲昭：「瞬時電圧低下が及ぼす事業中断リスク」, NKSJリスクマネジメントレポート, NKSJ Risk Management Inc. (2010)
3. (3) 「東芝の工場が瞬間停電で操業停止, NAND出荷量最大2割減も」, ロイター (2010)
4. (4) S. Nomura, T. Shintomi, S. Akita, T. Nitta, R. Shimada, and S. Meguro : “Technical and cost evaluation on SMES for electric power compensation”, IEEE Trans. Appl. Superconductivity, Vol. 20, No. 3, pp. 1373-1378 (2010)
5. (5) T. Motohiro, M. Sasaki, J.-H. Noh, O. Takai, and H. Honma : “Estimation of Electricity Storage Density of Compact SMESs Composed of Si-wafer Stacks Loaded with Superconducting Thin Film Coils in Spiral Trenches under the Constraints of the Critical Magnetic Flux Density”, J. Phys.: Conf. Series, Vol. 1590, No. 012045 (2020)
Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Measurement of Three‐Dimensional Bubble distributionVia Single‐Directional Capture Using a Light Field Camera;IEEJ Transactions on Electrical and Electronic Engineering;2024-02-11
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3