Evaluation of Thin Films Composition of Capacitive Micromachined Ultrasonic Transducers for Ultrasonic Diagnoses
Author:
Affiliation:
1. Center for Technology Innovation - Mechanical Engineering, Research and Development Group, Hitachi, Ltd.
2. Center for Technology Innovation - Electronics, Research and Development Group, Hitachi, Ltd.
Publisher
Institute of Electrical Engineers of Japan (IEE Japan)
Subject
Electrical and Electronic Engineering,Mechanical Engineering
Link
https://www.jstage.jst.go.jp/article/ieejsmas/137/10/137_341/_pdf
Reference12 articles.
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2. (2) C. Draft, P. Wagner, B. Bymaster, S. Panda, K. Patel, and I. Ladabaum : “cMUTs and electronic for 2D and 3D imaging : Monolithic integrateion, in-handle chip sets and system implications”, Proc. IEEE Ultrasonic Symposium, pp. 467-478 (2005)
3. (3) B. T. Khuri-Yakub and O. Oralkan : “Capacitive micromachined ultrasonic transducers for medical imaging and therapy”, J. Micromech. Microeng., 21, 054004 (2011)
4. (4) E. Bahette, J. F. Michaud, D. Certon, D. Gross, and D. Alquier : “Progresses in cMUT device fabrication using low temperature processes”, J. Micromech. Microeng., 24, 045020 (2014)
5. (5) A. Bagolini, A. S. Savoia, A. Picciotto, M. Boscardin, P. Bellutti, N. Lamberti, and G. Caliano : “PECVD low stress silicon nitride analysis and optimization for the fabrication of CMUT deveice”, J. Micromech. Microeng., 25, 015012 (2015)
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