Low-Temperature Direct Bonding of Flip-Chip Mountable VCSELs with Au-Au Surface Activation-Reference-Cited by-同舟云学术

Low-Temperature Direct Bonding of Flip-Chip Mountable VCSELs with Au-Au Surface Activation

Published:2008 Issue:6 Volume:128 Page:266-270
ISSN:1341-8939
Container-title:IEEJ Transactions on Sensors and Micromachines
language:en
Short-container-title:IEEJ Trans. SM

Author:

Imamura Teppei¹,Higurashi Eiji²,Suga Tadatomo¹,Sawada Renshi³

Affiliation:

1. Department of Precision Engineering, School of Engineering, University of Tokyo

2. Research Center for Advanced Science and Technology, University of Tokyo

3. Department of Intelligent Machinery and Systems, Graduate School of Engineering, Kyushu University

Publisher

Institute of Electrical Engineers of Japan (IEE Japan)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

http://www.jstage.jst.go.jp/article/ieejsmas/128/6/128_6_266/_pdf

Reference15 articles.

1. An integrated laser blood flowmeter

2. Micro-encoder based on higher-order diffracted light interference

3. (3) H. Okamoto and T. B. Massalski : Phase Diagram of Binary Gold Alloys, Metals Park, OH: ASM International, pp. 278-289 (1987)

4. (4) A. Ambrosy, H. Richter, J. Hehmann, and D. Ferling : “Silicon motherboards for multichannel optical modules”, IEEE Trans. Compon. Packag. Manuf. Technol. A, Vol. 19, pp. 34-40 (1996)

5. Thermosonic bonding of an optical transceiver based on an 8×8 vertical cavity surface emitting laser array

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