Study on Fabrication Method for Narrow Pitch Beams on Silicon Probe-Reference-Cited by-同舟云学术

Study on Fabrication Method for Narrow Pitch Beams on Silicon Probe

Published:2021-04-01 Issue:4 Volume:141 Page:96-102
ISSN:1341-8939
Container-title:IEEJ Transactions on Sensors and Micromachines
language:en
Short-container-title:IEEJ Trans. SM

Author:

Kanamaru Masatoshi¹,Aono Takanori¹,Kohno Ryuji¹,Hosogane Atsushi¹

Affiliation:

1. Center for Technology Innovation - Mechanical Engineering, Research & Development Group, Hitachi, Ltd.

Publisher

Institute of Electrical Engineers of Japan (IEE Japan)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

https://www.jstage.jst.go.jp/article/ieejsmas/141/4/141_96/_pdf

Reference10 articles.

1. (1) S. Tanaka, S. Fujimoto, O. Ito, S.-H. Choe, and M. Esashi : “Fabrication of Microprobes on a Ultarathick Glass Substrate with Narrow-Pitch Electrical feed Throughs for Ext-Generation LSI Burn-In Test”, Technical Digest MEMS2008, pp. 347-350 (2008)

2. (2) B. H. Kim, J. B. Kim, and J. H. Kim : “A Highly Manufacturable Large Area Array MEMS Probe Card Using Electroplating and Fripchip Bonding”, IEEE Trans. Ind. Elecrton, Vol. 56, No. 4, pp. 1079-1084 (2009)

3. (3) S. Asai, K. Kato, N. Nakazaki, and Y. Nakajima : “Probe Card with Probe Pins Grown by the Vapor-Liquid-Solid (VLS) Method”, IEEE Transactions on Components, Packaging, and Manufacturing Technology, PART A, Vol. 19, No. 2, pp. 258-267 (1996)

4. (4) M. Beiley, J. Leung, and S. S. Wong : “A Micromachined Array Probe Card - Fabrication Process”, IEEE Transactions on Components, Packaging, and Manufacturing Technology - PART B, Vol. 18, No. 1, pp. 179-183 (1995)

5. (5) G. Kimoto, T. Watanabe, S. Matsusaka, A. Inoue, and T. Kuroda : “A New Contact Probe without Cleaning Process”, Transactions of The Japan Institute of Electronics Packaging, Vol. 3, No. 1, pp. 91-96 (2010)