Development of Epoxy Resins with Controlled High Order Structures Having Excellent Heat Release Properties
Author:
Affiliation:
1. Hitachi, Ltd. Hitachi Research Laboratory
Publisher
Institute of Electrical Engineers of Japan (IEE Japan)
Subject
Electrical and Electronic Engineering
Link
http://www.jstage.jst.go.jp/article/ieejfms/123/7/123_7_687/_pdf
Reference21 articles.
1. Influences of inorganic fillers on curing reactions of epoxy resins initiated with a boron trifluoride amine complex
2. Thermal conductivity of polyethylene: The effects of crystal size, density and orientation on the thermal conductivity
3. Thermal conductivity of highly oriented polyethylene
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