Decomposition Processing System of the PCB Liquid Insulator by the Vacuum Induction Heating Decomposition Method-Reference-Cited by-同舟云学术

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Decomposition Processing System of the PCB Liquid Insulator by the Vacuum Induction Heating Decomposition Method

Published:2019-02-01 Issue:2 Volume:139 Page:119-129
ISSN:0385-4205
Container-title:IEEJ Transactions on Fundamentals and Materials
language:en
Short-container-title:IEEJ Trans. FM

Author:

Mukoyama Yoshihide¹,Kansa Haruka¹,Nagasawa Kaya¹,Kansa Ken²

Affiliation:

1. Shonan Institute of Technology

2. Belz Japan Corporation

Publisher

Institute of Electrical Engineers of Japan (IEE Japan)

Subject

Electrical and Electronic Engineering

Link

https://www.jstage.jst.go.jp/article/ieejfms/139/2/139_119/_pdf

Reference3 articles.

1. (11) D. S. Duvall and W. A. Rubey : “LABORATORY EVALUATION OF HIGH-TEMPERATURE DESTRUCTION OF POLYCHLORINATED BIPHENYLS AND RELATED COMPOUNDS”, EPA-600/2-77-228, p. 62 (1977)

2. (12) B. F. Rordorf : “THERMODYNAMIC AND THERMAL PROPERTIES OF POLYCHLORINATED COMPOUNDS:THE VAPOR PRESSURES AND FLOW TUBE KINETICS OF TEN DIBENZO-PARA-DIOXINES”, Chemosphere, Vol. 14, No. 6/7, pp. 885-892 (1985)

3. (14) K. C. Hou and H. B. Palmer : “The Kinetics of Thermal Decomposition of Benzene in a Flow System”, J. Phys. Chem., Vol. 69, No. 3, pp. 863-868 (1965)

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