Development History of the Double-sided Cooling Power Module Considering Electronic, Thermal and Mechanical Characteristics of Silicon Power Semiconductor Chips-Reference-Cited by-同舟云学术

Development History of the Double-sided Cooling Power Module Considering Electronic, Thermal and Mechanical Characteristics of Silicon Power Semiconductor Chips

Published:2020-03-01 Issue:3 Volume:140 Page:148-157
ISSN:0913-6339
Container-title:IEEJ Transactions on Industry Applications
language:en
Short-container-title:IEEJ Trans. IA

Author:

Tokura Norihito¹,Makino Tomoatsu

Affiliation:

1. Okazaki city, Aichi

Publisher

Institute of Electrical Engineers of Japan (IEE Japan)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

https://www.jstage.jst.go.jp/article/ieejias/140/3/140_148/_pdf

Reference42 articles.

1. (1) N. Hirano, K. Mamitsu, and T. Okumura: “Structural Development of Double-sided Cooling Power Modules”, DENSO Technical Review, Vol. 16, pp. 30-37 (2011) (in Japanese)

2. (2) Y. Sakai, H. Ishiyama, and T. Kikuchi: “Power Control Unit for High Power Hybrid System”, SAE Technical Paper, 2007-01-0271 (2007)

3. (5) O. Kitazawa, T. Kikuchi, M. Nakashima, Y. Tomita, H. Kosugi, and T. Kaneko: “Development of Power Control Unit for Compact-Class Vehicle”, SAE Technical Paper, 2016-01-1227 (2016)

4. (6) J. Gronvall, A. Uhlemann, and M. Sobkowiak: “A new approach to power electronics system integration with enhanced cooling solutions”, APE Technical Paper (2015)

5. (8) T. Kimura, N. Tokura, F. Ohara, and M. Mizukoshi: “Semiconductor device”, JP Laid-open patent, H10-56131 (1998) (in Japanese)

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