A Method of Third Party Verification for System Products Including the Presumption of Fault Location and Cause, and its Evaluation on the Implementation-Reference-Cited by-同舟云学术

A Method of Third Party Verification for System Products Including the Presumption of Fault Location and Cause, and its Evaluation on the Implementation

Published:2016 Issue:6 Volume:136 Page:868-880
ISSN:0385-4221
Container-title:IEEJ Transactions on Electronics, Information and Systems
language:en
Short-container-title:IEEJ Trans.EIS

Author:

Dosaka Shin¹,Ohe Nobuhiro¹,Kitagami Shinji²,Kambe Hidetoshi³,Koizumi Hisao⁴

Affiliation:

1. Melco Techno Yokohama Inc.

2. Global Information and Telecommunication Institute, Waseda University

3. Tokyo Denki University School of Science and Engineering

4. NPO Organization M2M Study Group

Publisher

Institute of Electrical Engineers of Japan (IEE Japan)

Subject

Electrical and Electronic Engineering

Link

https://www.jstage.jst.go.jp/article/ieejeiss/136/6/136_868/_pdf

Reference5 articles.

1. (3) S. Miyahara, T. Ibusuki, and H. Tanaka : “TMP for Assuring Quality of Hardware Productgs”, FUJITSU, 58, 4, pp. 365-369 (2007) (in Japanese)

2. (4) A. Suzuki, T. Suzuki, and T. Morinaga : “Approach to Process and Product Quality Improvement by Mean of Verification and Testing Conducted by Third Parties”, FUJITSU, 62, 2, pp. 248-253 (2011) (in Japanese)

3. (5) S. Matsumoto, H. Uwano, A. Monden, K. Matsumoto, M. Katahira, N. Kohtake, Y. Miyamoto, S. Ujihara, and S. Yoshikawa : “Quantitatively Characterizing Software IV&V Activities Based on Defect History”, IEICE, Vol. J92-D, No. 12, pp. 2159-2206 (2009) (in Japanese)

4. (10) H. Tsuji, J. Sawamoto, K. Seo, and K. Kitagami : “M2M (Machine-to- Machine) Technology Trend”, IEEJ Trans. EIS, Vol. 133, No. 3, pp. 520-531 (2013) (in Japanese)

5. (11) N. Ohe, S. Kitagami, H. Yonemori, M. Inoue, T. Shiotsuki, and H. Koizumi : “A proposal of an Education System for Manufacturing Technology using M2M Prototyping and its Practice”, IEEJ Trans. FM, Vol. 135, No. 11, pp. 655-665 (in Japanese)

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