Adhesion Sensing in an Electroadhesive Paper Handler and Its Application to Physical RPA-Reference-Cited by-同舟云学术

Adhesion Sensing in an Electroadhesive Paper Handler and Its Application to Physical RPA

Published:2023-01-01 Issue:1 Volume:143 Page:47-56
ISSN:0385-4221
Container-title:IEEJ Transactions on Electronics, Information and Systems
language:en
Short-container-title:IEEJ Trans.EIS

Author:

Okamoto Takuya¹,Itoh Hideaki²,Fukumoto Hisao²,Wakuya Hiroshi³

Affiliation:

1. Electrical and Electronic Engineering Course, Graduate School of Science and Engineering, Saga University

2. Department of Electrical and Electronic Engineering, Faculty of Science and Engineering, Saga University

3. Integrated Center for Educational Research and Development, Faculty of Education, Saga University

Publisher

Institute of Electrical Engineers of Japan (IEE Japan)

Subject

Electrical and Electronic Engineering

Link

https://www.jstage.jst.go.jp/article/ieejeiss/143/1/143_47/_pdf

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