Model Based Defect Detection in Multi-Dimensional Vector Spaces
Author:
Affiliation:
1. Yokohama Research Laboratory, Hitachi, Ltd.
2. Hitachi-High-Technologies
3. Information Science and Technology, Hokkaido University
Publisher
Institute of Electrical Engineers of Japan (IEE Japan)
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/ieejeiss/131/9/131_9_1633/_pdf
Reference5 articles.
1. (1) V. Sankaran, C. M. Weber, and K. W. Tobin : “Inspection in Semiconductor Manufacturing”, Webster's Encyclopedia of Electrical and Electronic Engineering, Vol. 10, pp. 242-262, Wiley & Sons, NY (1999)
2. (2) Y. Takagi, H. Shibuya, and N. Hosoya : “Defect Monitor Method Based on Sampling Review Plan”, IEEJ Trans. Electronics, Information and Systems C, Vol. 124, No. 3, pp. 748-752 (2004) (in Japanese)
3. (3) K. Watanabe, Y. Takagi, K. Obara, H. Okuda, R. Nakagaki, and T. Kurosaki : “Efficient Killer-Defect Control using Reliable High-Throughput SEM-ADC”, IEEE/SEMI Advanced Semiconductor Manufacturing Conference, pp. 219-222 (2001)
4. (4) T. Honda, K. Obara, M. Harada, and M. Ikeda : “High-Sensitivity Detection of Slight Deformation Using Multiple SEM Images”, IEEJ Trans. Electronics, Information and Systems, Vol. 129, No. 5, pp. 853-860 (2009) (in Japanese)
5. (5) Y. Matsuyama, H. Iwata, H. Kubota, and Y. Nakagawa : “Precise Visual Inspection of LSI Wafer Patterns by Local Perturbation Pattern Matching Algorith”, IEICE Trans. on Information and Systems, Vol. J72-D2, No. 12, pp. 2041-2050 (1989) (in Japanese)
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