Impact of Scaling on Back-Gate-Controlled IGBT (BC-IGBT)
Author:
Affiliation:
1. Institute of Indutrial Science, The University of Tokyo
Publisher
Institute of Electrical Engineers of Japan (IEE Japan)
Link
https://www.jstage.jst.go.jp/article/ieejeiss/144/3/144_245/_pdf
Reference21 articles.
1. (1) T. P. Chow, I. Omura, M. Higashiwaki, H. Kawarada, and V. Pala : “Smart Power Devices and ICs Using GaAs and Wide and Extreme Bandgap Semiconductors”, IEEE Transaction on Electron Device, Vol. 64, No. 3, pp. 856-873 (2017)
2. (2) A. Kopta, et al.: “Next Generation IGBT and Package Technologies for High Voltage Applications”, IEEE Transaction on Electron Device, Vol. 64, No. 3, pp. 753-759 (2017)
3. (3) N. Iwamuro and T. Laska : “IGBT History, State-of-the-Art, and Future Prospects”, IEEE Transaction on Electron Device, Vol. 64, No. 3, pp. 741-752 (2017)
4. (4) N. Iwamuro and T. Laska : “Correction to “IGBT History, State-of-the-Art, and Future Prospects”, IEEE Transaction on Electron Device, Vol. 65, p. 2675 (2018)
5. (5) M. Kitagawa, I. Omura, S. Hasegawa, T. Inoue, and A. Nakagawa : “A 4500V injection enhanced insulated gate bipolar transistor (IEGT) operating in a mode similar to a thyristor”, IEDM Tech. Dig., 28.3, pp. 679-681, Washington, DC, United States (1993)
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