Development of Reference Shunt for Short-time Alternating High Current Tests and Study of Measuring System

Author:

Kida Junzo1,Nakajima Masatoshi2,Goda Yutaka3,Kikuchi Kunio4,Kudo Kietsu5,Ishii Hiromi6,Matsui Yoshihiko7,Matsumura Toshiro8,Kawamura Tatsuo9

Affiliation:

1. Power Systems Company, High Voltage & High Power Testing Laboratory, Hitachi, Ltd.

2. Industrial Infrastructure Business Group, Fuji Electric Co., Ltd.

3. Central Research Institute of Electric Power Industry, Electric Power Engineering Research Laboratory

4. Transmission & Distribution Systems Center, High Voltage & High Power Testing Laboratory, Mitsubishi Electric Co., Ltd.

5. Power Systems Company, Toshiba Corporation

6. High Voltage & High Power Testing Laboratory, Nissin Electric Co., Ltd.

7. High Power Testing Laboratory, Meidensha Corporation

8. Graduate School of Engineering, Nagoya University

9. The University of Tokyo

Publisher

Institute of Electrical Engineers of Japan (IEE Japan)

Subject

Electrical and Electronic Engineering,Energy Engineering and Power Technology

Reference5 articles.

1. (1) S. Kon: “A Review of Alternating Current Shunt Standards”, AIST Bulletin of Metrology, Vol. 6, No. 4, p. 201 (2007) (in Japanese)

2. (2) International Electrotechnical Commission: “High-current test techniques—Definitions and requirements for test currents and measuring systems”, International Standard IEC 62475, Edition 1.0 (2010)

3. (3) International Organization for Standardization/International Electrotechnical Commission: “Uncertainty of Measurement—Part 3: Guide to the Expression of Uncertainty in Measurement (GUM: 1995)”, ISO/IEC Guide 98-3, First Edition (2008)

4. (4) T. Kawamura, E. Haginomori, Y. Goda, and T. Nakamoto: “Recent Development on High Current Measurement Using Current Shunt”, IEEJ Trans., Vol. 2, No. 5, pp. 516-522 (2007)

5. (5) Y. Goda, M. H. Kim, A. Wang, and G. Sengupta: “Comparison tests of high current shunts in high power laboratories in Asia with an STL reference shunt”, Transmission and Distribution Conference and Exposition (T&D), pp. 1-8 (2012)

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