Insulation Behavior of Small-air-gap for the Molded-insulation System-Reference-Cited by-同舟云学术

Insulation Behavior of Small-air-gap for the Molded-insulation System

Published:2011 Issue:7 Volume:131 Page:630-636
ISSN:0385-4213
Container-title:IEEJ Transactions on Power and Energy
language:en
Short-container-title:IEEJ Trans. PE

Author:

Higashiyama Masakazu¹,Suzuki Hayato¹,Hirose Tatsuya²,Nakamura Yusuke²,Maeda Teruhiko²,Hayama Takashi³,Nakamura Shuhei³,Umemura Hiro³,Kozako Masahio⁴,Hikita Masayuki⁴

Affiliation:

1. Toshiba Industrial Products Manufacturing Co.

2. Toshiba Co.

3. Mie University

4. Kyushu Institute of Technology

Publisher

Institute of Electrical Engineers of Japan (IEE Japan)

Subject

Electrical and Electronic Engineering,Energy Engineering and Power Technology

Link

http://www.jstage.jst.go.jp/article/ieejpes/131/7/131_7_630/_pdf

Reference16 articles.

1. (1) F. Paschen: “Tuber die zum Funkenubergang in Luft, Wasserstoff und Kohlensaure bei verschiedenen drunken erforderliche Potentialdifferenz”, Weid Ann. Physik und Chemie, Vol. 37, pp. 69-81 (1889)

2. (2) J. M. Meek and J. D. Craggs: Electrical breakdown of gases, Oxford Univ. Press, pp. 533-653 (1989)

3. (3) T. Mori and M. Tan: “Partial discharge property in a spherical void”, T. IEE Japan, Vol. 104, No. 11, pp. 629-634 (1984) (in Japanese)

4. 森内孝彦.丹通雄: 「球状ボイド内のおける放電時間遅れ」, 電学論, Vol. 104, No. 11, pp. 17-22 (1984)

5. ac (50 Hz) and dc electrical breakdown of vacuum gaps and with variation of air pressure in the range 10−9−10−2Torr using OFHC copper, nickel, aluminum, and niobium parallel planar electrodes

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