Electroless Plating Method by Using Gold Nanoparticle for Applications to Electronics and Bioanalysis
Author:
Publisher
Institute of Electrical Engineers of Japan (IEE Japan)
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/ieejjournal/130/12/130_12_816/_pdf
Reference10 articles.
1. (1) H. Shiigi, Y. Yamamoto, H. Yakabe, S. Tokonami, and T. Nagaoka : “Electrical Property and Water Repellency of a Networked Monolayer Film Prepared from Au Nanoparticles”, Chem. Commun., 2003, pp. 1038-1039 (2003)
2. (2) Y. Yamamoto, H. Shiigi, and T. Nagaoka : “Characterization of Au Nanoparticle Film Electrodes Prepared on Polystyrene, Electroanalysis, Vol. 17, No. 24, pp. 2224-2230 (2005)
3. (3) Y. Yamamoto, S. Takeda, H. Shiigi, and T. Nagaoka : “A Novel Electroless Plating Method for Conducting Microbeads by Using Gold Nanoparticle”, J. Electrochem. Soc., Vol. 154, No. 9, D462-D466 (2007)
4. (4) S. Tokonami, Y. Yamamoto, Y. Mizutani, I. Ota, H. Shiigi, and T. Nagaoka : “Green Electroless Plating Method Using Gold Nanoparticles for Conducting Microbeads : Application to Anisotropic Conductive Films”, J. Electrochem. Soc., Vol. 156, No. 12, D558-D563 (2009)
5. (5) A. D. Hayatt, D. A. McPhee, and J. R. White : “Antibody competition studies with gold-labelling immunoelectron microscopy”, J. Virol. Methods, Vol. 19, No. 1, pp. 23-32 (1988)
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