Two-dimensional numerical simulations of electrothermal behaviour in very large scale integrated contacts and vias

Author:

Allegretto W.,Nathan A.,Chau K.,Baltes H. P.

Abstract

We present results of electrothermal interactions in fine geometry contacts and vias. The results have been obtained using a two-dimensional model based on the finite-box procedure. For the contact geometry, large electric potential gradients and consequently high Joule-heating effects develop at the interface, which is relatively low in electrical conductivity. In the case of the via, however, temperature escalations result from singularities in the electric field at geometrically imperfect locations, owing to inadequate step coverage in the metallization process. In particular, we discuss the treatment of boundary conditions for the temperature equation.

Publisher

Canadian Science Publishing

Subject

General Physics and Astronomy

Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Analysis of Joule heating in multilevel interconnects;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;1999

2. Modelling of Heat Conduction and Thermal Stresses in Multilevel Interconnects;MRS Proceedings;1998-01

3. Time-Dependent Temperature Calculation of Aluminum Line Applied with Electrical-Overstress Pulses;Japanese Journal of Applied Physics;1996-07-15

4. estimate to the mixed boundary value problem for second order elliptic equations and its application in the thermistor problem;Nonlinear Analysis: Theory, Methods & Applications;1995-01

5. Three-dimensional thermal analysis of high density triple-level interconnection structures in very large scale integrated circuits;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;1994-01

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