Investigation on Thermal Release Behavior of Helium-Charged Copper Films by DC Magnetron Sputtering-Reference-Cited by-同舟云学术

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Investigation on Thermal Release Behavior of Helium-Charged Copper Films by DC Magnetron Sputtering

Published:2011-11 Issue:4 Volume:60 Page:1483-1486
ISSN:1536-1055
Container-title:Fusion Science and Technology
language:en
Short-container-title:Fusion Science and Technology

Author:

Qi Q.¹,Wang X. F.¹,Shi L. Q.¹,Zhang L.¹,Zhang B.¹,Lu Y. F.¹,Liu A.¹

Affiliation:

1. Applied Ion Beam Physics Laboratory, Institute of Modern Physics, Fudan University, Shanghai 200433, People’s Republic of China

Publisher

Informa UK Limited

Subject

Mechanical Engineering,General Materials Science,Nuclear Energy and Engineering,Nuclear and High Energy Physics,Civil and Structural Engineering

Link

https://www.tandfonline.com/doi/pdf/10.13182/FST11-A12712

Reference15 articles.

1. Formation of helium bubbles and dislocation loops in tritium-charged vanadium

2. Positron Studies of Helium in Ni, Ni-Ti and Ti-Stabilised Steel

3. Thermal release behavior of helium implanted into copper at high fluences

4. Trapping of deuterium by helium bubbles and defects in ion‐implanted tantalum

5. Precipitation in low energy helium irradiated molybdenum

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of He content on the evolution of He bubbles and He thermal desorption behaviors in FeCr based nanocrystalline film;Journal of Nuclear Materials;2021-11

2. Helium desorption behavior and growth mechanism of helium bubbles in FeCrNi film;Nuclear Materials and Energy;2019-12

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