Ultrasonic Bonding Technology for Flip Chip Packaging
Author:
Publisher
The Korean Welding and Joining Society
Link
http://ocean.kisti.re.kr/downfile/crosscheck/kws/JAKO200814364023058.pdf
Reference7 articles.
1. Reliability of nickel flip chip bumps with a tin–silver encapsulation on a copper/tin–silver substrate during the bonding process
2. Au Bump Interconnection with Ultrasonic Flip-Chip Bonding in 20 µm Pitch
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effects of shear test temperatures and conditions on mechanical properties of Sn–Ag flip-chip solder bumps;Journal of Materials Science: Materials in Electronics;2022-03-09
2. Ultrasonic Welding of Ni and Cu Sheets;Materials and Manufacturing Processes;2014-03-03
3. Design by Topology Optimization and Performance Test of Ultrasonic Bonding Module for Flip-Chip Packaging;Journal of the Korean Welding and Joining Society;2012-12-31
4. Reliability Evaluation of Electronic Circuit Printed Using Metallic Ink;Journal of the Korean Welding and Joining Society;2008-04-30
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