1. Yeh C.-H., Chang L.-S., Straumal B. The Grain Boundary Wetting in the Sn – 25 at% In Alloys. Defect and Diffusion Forum, 2006, vol. 258–260, pp. 491–496. https://doi.org/10.4028/www.scientific.net/DDF.258-260.491
2. Andryushchenko M. Lead-free soldering. Alternative alloys. Elektronika: Nauka, tekhnologia, biznes = Electronics: Science, Technology, Business, 2004, no. 5, pp. 47–49 (in Russian).
3. Yeh Chien-Hsuan, Chang Li-Shin, Straumal B. Wetting Transition of Grain Boundaries in Tin-Rich Indium-Based Alloys and Its Influence on Electrical Properties. Materials Transactions, 2010, vol. 51, no. 9, pp. 1677–1682. https://doi.org/10.2320/matertrans.M2010159
4. Ozga P., Świątec Z., Michalec M., Onderka B., Bonarski J. Phase structure and texture of electrodeposited InSn alloys on copper Substrate. Archives of Metallurgy and Materials, 2008, vol. 53, iss. 1, pp. 307–315.
5. Vasil’yev V. A., Mitin B. S., Pashkov I. N., Serov M. M., Skuridin A. A., Lukin A. A., Yakovlev V. B. Rapid solidification of melts: theory, technology and materials. Moskow, SP Intermet Inzhiniring Publ., 1998. 400 p. (in Russian).