Investigation of copper corrosion behavior in chloride bath for nickel electrodeposition

Abstract

The present study is devoted to the electrodeposition of  nickel layers on copper substrates by cyclic voltammetry from chloride bath at a scan rate of 20 mV/s and at different bath temperatures between 25 and 55 °C  and  then after to their  corrosion behavior in chloride bath. The electrochemical behavior and corrosion properties were evaluated by cyclic voltammetry, potentiodynamic and electrochemical impedance spectroscopy. While the surface analysis of nickel coating at different temperatures was conducted by optical microscopy and white light interferometer (WLI). The obtained results show that the Ni layers have been deposited successfully on the Cu substrates. It was found that raising the bath temperature to 55 °C leads to smoother, dense, compact and recovering Ni coatings with a grain size of 0.024 nm and 0.294 µm as average roughness, which is mainly due to Ni grain refinement. While the effect of increasing bath temperature leads to a decrease in the corrosion resistance of copper.