Author:
Lambert Damien,Rahn Jeff,Sodagar Majid,Askari Murtaza,Apiratikul Paveen,Spann John,Pham Thang,Huang Yishen,Krasulick Stephen
Abstract
We present a low-cost, scalable 3.2Tbps heterogenous photonic integrated circuit chip assembled in a co-packaged optics configuration. The integration of III-V material directly into the Silicon-Photonic chip offers clear form-factor, density, and thermal dissipation advantages.