Determining the out-of-plane thermal expansion coefficient by analyzing the temperature dependence of thin-film interference fringes
Author:
Publisher
The Optical Society
Subject
Electronic, Optical and Magnetic Materials
Reference18 articles.
1. Chain orientation and anisotropies in optical and dielectric properties in thin films of stiff polyimides
2. Anisotropic Linear and Volumetric Thermal-Expansion Behaviors of Self-Standing Polyimide Films Analyzed by Thermomechanical Analysis (TMA) and Optical Interferometry
3. Effective Reduction of Volumetric Thermal Expansion of Aromatic Polyimide Films by Incorporating Interchain Crosslinking
4. Effects of chain packing and structural isomerism on the anisotropic linear and volumetric thermal expansion behaviors of polyimide films
5. Refractive index measurements of poly(methyl methacrylate) (PMMA) from 04–16 μm
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1. Amorphous optical polyimides for thermally stable, high-temperature optical components;Organic Photonic Materials and Devices XXV;2023-03-14
2. Copolyimides for gradient-index optics;Optical Materials Express;2022-09-23
3. Out-of-Plane Thermal Expansion Coefficient and Biaxial Young’s Modulus of Sputtered ITO Thin Films;Coatings;2021-01-29
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