Flexible and accurate system calibration method in microscopic fringe projection profilometry

Author:

Du Junlin1,Luo Xiaopeng,Zhu JiangpingORCID,An Shiyong,Zhou PeiORCID

Affiliation:

1. Anshi Technology Co., Ltd.

Abstract

The three-dimensional (3D) measurement task of complex microstructures holds paramount significance in the domains of precision manufacturing and inspection. The calibration of the 3D system heavily determines the final reconstruction accuracy. The widely adopted system calibration method is phase-height mapping (PHM) and stereo vision (SV) based. The former can be applied directly to the calculation without considering the imaging model of the system, but it relies on highly precise and expensive translation stages or standard blocks. The latter’s accuracy cannot be guaranteed because it is difficult to accurately calibrate the projector. In this paper, we establish an optically coupled microscopic fringe projection profilometry system that consists of a Scheimpflug pinhole projector and a super-low distortion bi-telecentric camera. We introduce a simplified 3D system calibration approach that combines phase modulation transfer and ray propagation. Our method enables the simultaneous calibration of the system, including the calibration of the projector, camera, and the phase to a 3D coordinates relationship, using only a 2D target. The calibrated projector’s external parameters are used to obtain the target’s complete poses, and then the direct mapping coefficients of the phase to the 3D coordinates can be obtained through the optical geometry structure and phase labels. Comparable experiments verify the feasibility of the proposed method.

Funder

National Natural Science Foundation of China

Central Government Guides Local Funds for Science and Technology Development

China Postdoctoral Science Foundation

Key Research and Development Program of Sichuan Province

Publisher

Optica Publishing Group

Subject

Atomic and Molecular Physics, and Optics,Engineering (miscellaneous),Electrical and Electronic Engineering

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