Affiliation:
1. Tianjin University
2. Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology
Abstract
As the level of detail in today’s images increases, so does the demand
for resolution. Due to the necessity of mask stitching technology for
full exposure of large array chips, we propose a mask configurable
readout circuit architecture, which is suitable for large array
structures. However, the stitchable readout circuit architecture has
some non-ideal effects: row driver function failure and the column
non-consistency problem. In our design, we solve the problem of column
non-consistency after stitching. At the same time, we changed the
signal transmission structure in order to avoid the row driver
function failure caused by the mask stitching. In this paper, a
prototype
2130
×
2130
CMOS image sensor is fabricated in
0.11 µm CMOS technology. The chip can capture images at 20 fps and
reduce fixed pattern noise (FPN) from 3.5% to 1.5% through correction
techniques. The architecture proposed in this paper is suitable for
large array image sensors.
Funder
National Key Research and Development
Program of China
Subject
Atomic and Molecular Physics, and Optics,Engineering (miscellaneous),Electrical and Electronic Engineering
Cited by
1 articles.
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