Low loss and robust photonic packaging using fusion splicing-Reference-Cited by-同舟云学术

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Low loss and robust photonic packaging using fusion splicing

Published:2019 Issue: Volume: Page:
ISSN:
Container-title:Conference on Lasers and Electro-Optics
language:
Short-container-title:

Author:

Nauriyal Juniyali,Song Meiting,Yu Raymond,Cardenas Jaime

Publisher

OSA

Reference6 articles.

1. A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities

2. Quasi-vertical tapers for polymer-waveguide-based interboard optical interconnects

3. Low-Loss and Broadband Cantilever Couplers Between Standard Cleaved Fibers and High-Index-Contrast Si$_{3}$N$_{4}$ or Si Waveguides

4. Fusion splicing between deposited silica waveguides and optical fibers

5. Fiber-to-chip coupler designed using an optical transformation

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Chip-scale optical phased arrays for inter-spacecraft communications;Micro- and Nanotechnology Sensors, Systems, and Applications XI;2019-05-13

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