Author:
Ling Yi-Chun,Lee Shun-Hung,Saleque Ahmed Mortuza,Zhang Yichi,Ben Yoo S. J.
Abstract
We discuss the impact of the 3D photonic integrated circuits (PICs), review enabling technologies including optical through-silicon-vias, and cover co-integration and co-design of 3D Electronic-Photonic-Integrated-Circuits (3D EPICs).