A High End Routing Platform for Core and Edge Applications Based on Chip To Chip Optical Interconnect-Reference-Cited by-同舟云学术

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A High End Routing Platform for Core and Edge Applications Based on Chip To Chip Optical Interconnect

Published:2013 Issue: Volume: Page:
ISSN:
Container-title:Optical Fiber Communication Conference/National Fiber Optic Engineers Conference 2013
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Author:

Hasharoni Kobi,Benjamin Shuki,Geron Amir,Katz Gideon,Stepanov Stanislav,Margalit Niv,Mesh Michael

Publisher

OSA

Reference5 articles.

1. Energy Consumption in Optical IP Networks

2. Optical I/O Technology for Tera-Scale Computing

3. Optical Interconnects for High-Performance Computing

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1. Co‐packaged datacenter optics: Opportunities and challenges;IET Optoelectronics;2021-03-22

2. Recent Progress and Prospects on Optical Packaging Technology;Journal of Japan Institute of Electronics Packaging;2018

3. Energy-Optimal Routing on VCSEL-Based Interconnected Networks;Journal of Optical Communications and Networking;2017-09-14

4. The role of optical interconnects in the design of data center architectures;Optical Interconnects for Data Centers;2017

5. Recent Advances and Prospects in the Packaging Architecture for Optical Interconnection;Journal of Japan Institute of Electronics Packaging;2017

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