Broadband and efficient multi-mode fiber-chip edge coupler on a silicon platform assisted with a nano-slot waveguide

Author:

Li Kang1,Cao Xiaoping1,Wang Jian1ORCID

Affiliation:

1. Optics Valley Laboratory

Abstract

Mode-division multiplexing (MDM) has been extensively utilized to expand the capacity of chip-scale or fiber-based optical communication, whereas it is still challenging to implement the MDM for fiber-chip optical interconnects due to the huge mode mismatch between few-mode fiber (FMF) and multi-mode waveguide. In this work, we propose and design a silicon integrated six-mode edge coupler assisted with a slot waveguide, which achieves the efficient direct conversion of multiple modes between the waveguide and fiber in a broad bandwidth. Based on the principle of mode conversion, this edge coupler enables the mode conversion between six linear polarization (LP) modes (i.e. LP x/y 01 , LP x/y 11a , LP x/y 11 b ) in FMF and six on-chip waveguide modes (i.e. TE0, TE1, TE2, TM0, TM1, TM2) with low insertion loss, low mode crosstalk and broad bandwidth. The obtained results show that over the whole C-band the efficiency of mode conversion is higher than 98% and the mode crosstalk is low than -19 dB, while the total coupling loss is higher than 85%. The favorable results offer an important reference for designing related broadband photonic devices, and the presented scheme could be potentially exploited to further increase the transmission capability for prospective fiber-chip optical interconnections and communications.

Funder

National Key Research and Development Program of China

National Natural Science Foundation of China

the Key R&D Program of Hubei Province of China

the Key R&D Program of Guangdong Province

the Science and Technology Innovation Commission of Shenzhen

Fundamental Research Funds for the Central Universities

Publisher

Optica Publishing Group

Subject

Atomic and Molecular Physics, and Optics

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Fiber-Chip Link via Mode Division Multiplexing;IEEE Photonics Technology Letters;2023-10-01

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