Affiliation:
1. Nanjing University of Aeronautics and Astronautics
Abstract
Dynamic 3D displacement field measurement is an effective means to
characterize the electrical performance stability and structural
soundness of microsystems. Combining off-axis lensless Fourier
transform multiplexed digital holography and multi-illumination
profilometry, a dual-wavelength dual-camera optical setup with a
multi-illumination system is developed to simultaneously acquire four
phase images with different sensitivity vectors, as well as the object
shapes. Meanwhile, the shared reference wave in off-axis lensless
Fourier holography gives a convenient way for sensitivity vector
modification and phase image registration, which are based on the
stereo checkerboard calibration method. The dynamic 3D displacement
fields and the strain maps of an energized integrated circuit board
reveal that the inhomogeneous thermal expansion may cause some damage
to chips, such as pin desoldering and microstructure fracture.
Funder
Priority Academic Program Development of
Jiangsu Higher Education Institutions
Subject
Atomic and Molecular Physics, and Optics,Engineering (miscellaneous),Electrical and Electronic Engineering