Thermal management of photonic integrated circuits: impact of holder material and epoxies-Reference-Cited by-同舟云学术

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Thermal management of photonic integrated circuits: impact of holder material and epoxies

Published:2019-07-31 Issue:22 Volume:58 Page:6126
ISSN:1559-128X
Container-title:Applied Optics
language:en
Short-container-title:Appl. Opt.

Author:

Kyatam Shusmitha,Mukherjee Debarati,Neto Hugo,Mendes Joana C.

Funder

European Regional Development Fund (FEDER)

Fundação para a Ciência e Tecnologia (FCT) / Ministério da Educação e Ciência (MEC)

Publisher

The Optical Society

Subject

Atomic and Molecular Physics, and Optics,Engineering (miscellaneous),Electrical and Electronic Engineering

Reference13 articles.

1. Thermal challenges in photonic integrated circuits;Punch,2012

2. Substrate Thickness Effects on Thermal Crosstalk in InP-Based Photonic Integrated Circuits

3. A Vision for Thermally Integrated Photonics Systems

4. Thermal management in hybrid silicon lasers;Sysak,2013

5. Minimizing temperature sensitivity of silicon Mach-Zehnder interferometers

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1. Influence of processing conditions on the titanium/nickel contact metallization on a silicon wafer for thermal management;Thin Solid Films;2023-11

2. High-quality factor Ta₂O₅-on-insulator resonators with ultimate thermal stability;Optics Letters;2023-10-31

3. Photonic Integrated Circuits for Passive Optical Networks: Outlook and Case Study of Integrated Quasi-Coherent Receiver;Photonics;2023-02-08

4. Integrated Photonics Packaging: Challenges and Opportunities;ACS Photonics;2022-10-19

5. Estimation of maximum temperature and thermal crosstalk between two active elements in a PIC: development of a thermal equivalent circuit;Applied Optics;2020-09-29

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