Extremely compact hybrid III-V/SOI lasers: design and fabrication approaches-Reference-Cited by-同舟云学术

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Extremely compact hybrid III-V/SOI lasers: design and fabrication approaches

Published:2015-01-30 Issue:3 Volume:23 Page:2696
ISSN:1094-4087
Container-title:Optics Express
language:en
Short-container-title:Opt. Express

Author:

Bondarenko Olesya,Fang Cheng-Yi,Vallini Felipe,Smalley Joseph S. T.,Fainman Yeshaiahu

Funder

Cymer Corporation

Defense Advanced Research Projects Agency (DARPA)

National Science Foundation (NSF)

NSF Center for Integrated Access Networks

Office of Naval Research (ONR)

Publisher

The Optical Society

Subject

Atomic and Molecular Physics, and Optics

Reference77 articles.

1. Optical interconnects to electronic chips

2. 1109-Tbit/s SDM transmission over 6,370 km using a full C-band seven-core EDFA

3. Enhancing optical communications with brand new fibers

4. Towards high-capacity fibre-optic communications at the speed of light in vacuum

5. Silicon mode (de)multiplexer enabling high capacity photonic networks-on-chip with a single-wavelength-carrier light

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