Author:
Cuyvers Stijn,Vanackere Tom,Vandekerckhove Tom,Poelman Stijn,de Beeck Camiel Op,De Witte Jasper,Hermans Artur,Van Gasse Kasper,Picqué Nathalie,Van Thourhout Dries,Roelkens Gunther,Clemmen Stéphane,Kuyken Bart
Abstract
Microtransfer printing of silicon and lithium niobate thin films on generic integrated photonic platforms is demonstrated. An unprecedented integration yield is achieved using crack barriers as a way to mitigate stress-induced shears in the material.
Cited by
1 articles.
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