Infrared dielectric response of nanoscribe IP-dip and IP-L monomers after polymerization from 250 cm^−1 to 6000 cm^−1-Reference-Cited by-同舟云学术

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Infrared dielectric response of nanoscribe IP-dip and IP-L monomers after polymerization from 250 cm^−1 to 6000 cm^−1

Published:2017-02-15 Issue:3 Volume:7 Page:888
ISSN:2159-3930
Container-title:Optical Materials Express
language:en
Short-container-title:Opt. Mater. Express

Author:

Fullager Daniel B.,Boreman Glenn D.,Hofmann Tino

Funder

Army Research Office (ARO)

national science foundation (NSF)

Publisher

The Optical Society

Subject

Electronic, Optical and Magnetic Materials

Reference12 articles.

1. Tailored 3D Mechanical Metamaterials Made by Dip-in Direct-Laser-Writing Optical Lithography

2. Approaching theoretical strength in glassy carbon nanolattices

3. Photonic wire bonding: a novel concept for chip-scale interconnects

4. Novel concept for three-dimensional polymer waveguides for optical on-chip interconnects

5. Broadband circularly polarizing dichroism with high efficient plasmonic helical surface

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