Abstract
Strategies for improved fabrication of integrated thin-film lithium
niobate electro-optic (EO) Mach–Zehnder modulators (MZMs) are
reported using scalable processes and designs. The MZM devices utilize
direct bonding of unetched and unpatterned thin-film lithium niobate
to patterned and planarized silicon photonic microchips. The latter
contains silicon nitride waveguide structures of various widths that
are used to form hybrid modes that are suitable for high-bandwidth
low-voltage EO modulators based on Pockels effect. We report that the
incorporation of appropriately designed outgassing channels and
certain modifications to key processing steps helped achieve a greater
than 99% reduction in void density during bonding. Void reduction is
critically important for these traveling-wave hybrid MZM devices in
which the optical mode is controllably distributed between multiple
thin layers and propagates over millimeter-scale lengths.
Funder
U.S. Department of Defense
Office of Naval Research
Sandia National
Laboratories
National Science Foundation
U.S. Government
Subject
Atomic and Molecular Physics, and Optics,Statistical and Nonlinear Physics
Cited by
3 articles.
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