Depth and thermal sensor fusion to enhance 3D thermographic reconstruction-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Depth and thermal sensor fusion to enhance 3D thermographic reconstruction

Published:2018-03-21 Issue:7 Volume:26 Page:8179
ISSN:1094-4087
Container-title:Optics Express
language:en
Short-container-title:Opt. Express

Author:

Cao Yanpeng,Xu Baobei,Ye Zhangyu,Yang Jiangxin,Cao Yanlong,Tisse Christel-Loic,Li Xin

Funder

National Natural Science Foundation of China (NSFC)

Publisher

The Optical Society

Subject

Atomic and Molecular Physics, and Optics

Reference20 articles.

1. HeatWave: A handheld 3D thermography system for energy auditing

2. Real-Time Mobile 3D Temperature Mapping

3. Generating High Fidelity 3-D Thermograms With a Handheld Real-Time Thermal Imaging System

4. RGB-D mapping: Using Kinect-style depth cameras for dense 3D modeling of indoor environments

5. 3-D Depth Reconstruction from a Single Still Image

Cited by 34 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal-Depth Odometry in Challenging Illumination Conditions;IEEE Robotics and Automation Letters;2023-07

2. L²V²T²Calib: Automatic and Unified Extrinsic Calibration Toolbox for Different 3D LiDAR, Visual Camera and Thermal Camera;2023 IEEE Intelligent Vehicles Symposium (IV);2023-06-04

3. Sensor Fusion for the Robust Detection of Facial Regions of Neonates Using Neural Networks;Sensors;2023-05-19

4. RGB-T image analysis technology and application: A survey;Engineering Applications of Artificial Intelligence;2023-04

5. 3D Multi-Modality Medical Imaging: Combining Anatomical and Infrared Thermal Images for 3D Reconstruction;Sensors;2023-02-01

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3