20 dB improvement utilizing custom-designed 3D-printed terahertz horn coupler

Author:

Wang QigejianORCID,Shah Syed Daniyal Ali,Li Haisu1ORCID,Kuhlmey Boris2ORCID,Atakaramians Shaghik

Affiliation:

1. Beijing Jiaotong University

2. The University of Sydney

Abstract

Terahertz band is envisaged to provide substantially higher capacity and much lower latency for wireless communications in contrast to microwave frequencies. Moving to higher frequencies comes with its own unique challenges to be addressed, such as poor coupling efficiency from free space into and out of planar air-core waveguides. Here, we propose a framework for rapid design and low-cost fabrication of terahertz horn couplers. The horn couplers are first designed by maximizing the field overlap integral on apex and aperture interfaces, then fabricated exploiting 3D printing technique, and finally sputtered with a thin layer of gold. A 28~μm standard deviation of the surface roughness height of the 3D printed horn couplers is calculated. Experimental demonstrations show that the proposed horn coupler improves the transmittance of a hybrid photonic crystal waveguide by 20 dB in comparison with the previous pinhole-based coupling configuration. This work provides a fast, convenient and economical approach for design and fabrication of customized couplers for any waveguide size, with a cost of only 5% of commercially available counterparts, and could be integrated in 3D-printed terahertz devices during fabrication.

Funder

Fundamental Research Funds for the Central Universities

National Natural Science Foundation of China

Publisher

Optica Publishing Group

Subject

Atomic and Molecular Physics, and Optics

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Demonstration of photonics-based D-band integrated localization and communication;Applied Optics;2024-05-14

2. Integratable 3D Printed Terahertz Horn Coupler;2023 48th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz);2023-09-17

3. Terahertz Hybrid Topological Chip for 10-Gbps Full-Duplex Communications;Electronics;2022-12-27

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