Affiliation:
1. Zhejiang University
2. Shanghai Jiao Tong University
3. University of California Santa Barbara
4. King Abdullah University of Science and Technology (KAUST)
5. Huazhong University of Science and Technology
6. China Information and Communication Technologies Group Corporation (CICT)
7. The Chinese University of Hong Kong
Abstract
In recent years, optical modulators, photodetectors, (de)multiplexers, and heterogeneously integrated lasers based on silicon optical platforms have been verified. The performance of some devices even surpasses the traditional III-V and photonic integrated circuit (PIC) platforms, laying the foundation for large-scale photonic integration. Silicon photonic technology can overcome the limitations of traditional transceiver technology in high-speed transmission networks to support faster interconnection between data centers. In this article, we will review recent progress for silicon PICs. The first part gives an overview of recent achievements in silicon PICs. The second part introduces the silicon photonic building blocks, including low-loss waveguides, passive devices, modulators, photodetectors, heterogeneously integrated lasers, and so on. In the third part, the recent progress on high-capacity silicon photonic transceivers is discussed. In the fourth part, we give a review of high-capacity silicon photonic networks on chip.
Funder
National Key Research and Development Program of China
“Pioneer” and “Leading Goose” RD Program of Zhejiang
National Natural Science Foundation of China
Fundamental Research Funds for the Central Universities
Subject
Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Cited by
91 articles.
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