Affiliation:
1. Chinese Academy of Sciences
2. South-Central University for Nationalities
Abstract
Laser direct writing (LDW) is a promising candidate for the fabrication of all-dielectric THz absorbers for its high flexibility and material compatibility. However, multi-step processing or multi-layer materials are required to compensate for the nonideal features of LDW to realize good absorption performance. To further explore the potential of LDW in flexible and cost-effective THz absorber fabrication, in this work, we demonstrate a design method of THz absorbers fully considering and utilizing the characteristics of laser processing. Specifically, we first numerically analyze that by properly combining basic structures processed by single-step LDW, good and adjustable absorption performance can be achieved on a single-layer substrate. Then we experimentally fabricate THz absorbers by processing periodic composite structures, which are combined by grooves and circular holes, on single-layer doped silicon using LDW. Experimental results show that our method can fabricate THz absorbers at a speed of 3.3 mm2/min with an absorptivity above 90% over a broadband of 1.8-3 THz. Our method provides a promising solution for the flexible and efficient fabrication of all-dielectric broadband THz absorbers.
Funder
National Natural Science Foundation of China
The Key Research and Development Program of Hubei province
Independent Scientific Research
Fundamental Research Funds for the Central Universities
Subject
Atomic and Molecular Physics, and Optics
Cited by
1 articles.
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