Supercritical fluid-enhanced IFVD quantum well intermixing for the regrowth-free photonic integration of EAM and SOA-Reference-Cited by-同舟云学术

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Supercritical fluid-enhanced IFVD quantum well intermixing for the regrowth-free photonic integration of EAM and SOA

Published:2018-08-08 Issue:9 Volume:8 Page:2592
ISSN:2159-3930
Container-title:Optical Materials Express
language:en
Short-container-title:Opt. Mater. Express

Author:

Chen Yang-Jeng,Chen Rih-You,Shiu Chih-Cheng,Hsu Wen-Kuan,Lin Wei-Chen,Lin Yu-Hung,Chang Ting-Chang,Chiu Yi-Jen

Funder

National Science Center Taiwan

Publisher

The Optical Society

Subject

Electronic, Optical and Magnetic Materials

Reference17 articles.

1. Monolithic integration via a universal damage enhanced quantum-well intermixing technique

2. A comparison of carbon and zinc doping in GaAs/AlGaAs lasers bandgap-tuned by impurity-free vacancy disordering

3. Impurity-induced disordering of AIGalnAs quantum wells by low temperature Zn diffusion

4. Regrowth-free high-gain InGaAsP/InP active-passive platform via ion implantation

5. Influence of Low-Temperature Chemical Vapor Deposited SiO[sub 2] Capping Layer Porosity on GaAs/AlGaAs Quantum Well Intermixing

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. 1.3-µm identical active electro-absorption modulated laser with quantum well intermixed passive waveguide;Optics Express;2024-01-17

2. High-speed optical modulation through the quantum well intermixing (QWI) semiconductor optical amplifier (SOA)-integration electroabsorption modulator (EAM);2023 28th Microoptics Conference (MOC);2023-09-24

3. Low-Loss Buried-Heterostructure Optical Waveguide Based on Impurity-Free-Vacancy-Diffusion Quantum Well Intermixing;IEEE Photonics Journal;2020-04

4. A low-temperature supercritical nitridation technology for enhancing the performance of AlGaN/GaN HEMTs;The Journal of Supercritical Fluids;2020-04

5. Fully-transparent resistance switching memristor based on indium-tin-oxide material;Journal of Micromechanics and Microengineering;2020-02-19

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