Electrodeposition of Copper in a Citrate Bath and Its Application to a Micro-Electro-Mechanical System-Reference-Cited by-同舟云学术

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Electrodeposition of Copper in a Citrate Bath and Its Application to a Micro-Electro-Mechanical System

Published:2010 Issue:10 Volume:26 Page:2625-2632
ISSN:1000-6818
Container-title:Acta Physico-Chimica Sinica
language:en
Short-container-title:

Author:

Wei-Gang WU, ,Fang-Zu YANG,Ming-Hui LUO,Zhong-Qun TIAN,Shao-Min ZHOU,

Publisher

Acta Physico-Chimica Sinica & University Chemistry Editorial Office, Peking University

Subject

Physical and Theoretical Chemistry

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Structure and optical band gap of porous nano-Cu-SiC composite films prepared via magnetron sputtering;Vacuum;2023-07

2. Ampere-level current density ammonia electrochemical synthesis using CuCo nanosheets simulating nitrite reductase bifunctional nature;Nature Communications;2022-12-22

3. Effects of Additive on the Electrodeposition and Coating Structure in a Novel System of Electronic Copper Electroplating;CHEM J CHINESE U;2021

4. Studying the kinetics of electrode reactions on copper, silver and gold in acid thiourea-citrate electrolytes;Materials Today: Proceedings;2019

5. Anodic Behavior of Copper in 1-Hydroxyethylene-1, 1-Diphosphonic Acid (HEDPA) Baths;Advanced Materials Research;2012-02

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