Electrochemical dissolution of chalcopyrite in the presence of thiourea and formamidine disulfide

Author:

Olvera Oscar G.,Rebolledo MonserratORCID,Mora Nelson,Dixon David G.,Asselin Edouard

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Industrial and Manufacturing Engineering

Reference13 articles.

1. Effect of thiourea on copper dissolution and deposition;Alodan;Electrochim. Acta,1998

2. Potentiometric measurements of copper diffusion in polycrystalline chalcocite, chalcopyrite and bornite;Berger;Solid State Ionics,1996

3. Theoretical models for ac impedance of fine diffusion layers exhibiting low frequency dispersion;Bisquert;J. Electroanal. Chem.,1999

4. Process for leaching metal sulfides with reagents having thiocarbonyl functional groups;Dixon,2016

5. Equilibrium and redox kinetics of copper(II)−thiourea complexes;Doona;Inorg. Chem.,1996

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