Electrochemical dissolution of chalcopyrite in the presence of thiourea and formamidine disulfide
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Industrial and Manufacturing Engineering
Reference13 articles.
1. Effect of thiourea on copper dissolution and deposition;Alodan;Electrochim. Acta,1998
2. Potentiometric measurements of copper diffusion in polycrystalline chalcocite, chalcopyrite and bornite;Berger;Solid State Ionics,1996
3. Theoretical models for ac impedance of fine diffusion layers exhibiting low frequency dispersion;Bisquert;J. Electroanal. Chem.,1999
4. Process for leaching metal sulfides with reagents having thiocarbonyl functional groups;Dixon,2016
5. Equilibrium and redox kinetics of copper(II)−thiourea complexes;Doona;Inorg. Chem.,1996
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