1. Challenges of Cu wire bonding on low-k/Cu wafers with BOA structures;Lee,2010
2. Development and Qualification of Copper Wire Bond Process for Automotive Applications, International Conference on Electronic Materials and Packaging;Hiew,2012
3. Copper versus palladium coated copper wire process and reliability differences;Lee,2014
4. Wire bonding optimization with fine copper wire for volume production;Yauw,2010
5. Die to Die Copper Wire Bonding Enabling Low Cost 3D Packaging, Electronic Components and Technology Conference;Carson,2011