Analysis of stress intensity factors for edge interfacial cracks in bonded dissimilar media with a functionally graded interlayer under antiplane deformation
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,Mechanical Engineering,Condensed Matter Physics,General Materials Science
Reference41 articles.
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4. On the mechanical modeling of the interfacial region in bonded half-planes;Delale;ASME J. Appl. Mech.,1988
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