Effect of microstructure on crack behavior in nanocrystalline nickel using molecular dynamics simulation
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,Mechanical Engineering,Condensed Matter Physics,General Materials Science
Reference58 articles.
1. Mechanical behavior of nanocrystalline metals and alloys;Kumar;Acta Mater.,2003
2. Grain-boundary structures in polycrystalline metals at the nanoscale;Van Swygenhoven;Phys. Rev. B,2000
3. Molecular dynamics investigation of the fracture behavior of nanocrystalline α-Fe;Latapie;Phys. Rev. B,2004
4. Fracture resistance of nanocrystalline Ni;Farkas;Metall. Mater. Trans. A,2007
5. Grain-size dependent mechanical behavior of nanocrystalline metals;Hahn;Mater. Sci. Eng., A,2015
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Simultaneous effect of grain size and indenter dimension on the dislocation nucleation and growth in nanoindentation and nanoscratch processes;The European Physical Journal Plus;2024-05-20
2. Multiscale modeling of nanoindentation and nanoscratching by generalized particle method;Journal of Molecular Graphics and Modelling;2024-03
3. Molecular dynamics simulation of Cr–O–C discrete nuclei to reduce the binding force of nanocrystalline Cu/Ni complexes;Journal of Materials Science;2024-02
4. Atomic‐Scale Study on the Interaction Mechanism between Cracking and Typical Grain Boundaries in 15‐5 PH Stainless Steel;steel research international;2023-01-19
5. Atomistic evaluation of stress intensity factors and higher-order terms of 2D Williams series expansion by molecular dynamics method;30TH RUSSIAN CONFERENCE ON MATHEMATICAL MODELLING IN NATURAL SCIENCES;2023
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3