Microstructural modification of W–SiC bonded plate during high temperature exposure-Reference-Cited by-同舟云学术

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Microstructural modification of W–SiC bonded plate during high temperature exposure

Published:2016-11 Issue: Volume:109-111 Page:1678-1681
ISSN:0920-3796
Container-title:Fusion Engineering and Design
language:en
Short-container-title:Fusion Engineering and Design

Author:

Asakura Yuuki,Kishimoto Hirotatsu,Nakazato Naofumi,Park Joon-Soo,Kohyama Akira

Publisher

Elsevier BV

Subject

Mechanical Engineering,General Materials Science,Nuclear Energy and Engineering,Civil and Structural Engineering

Reference9 articles.

1. ITER tungsten divertor design development and qualification program;Hirai;Fusion Eng. Des.,2013

2. Hydrogen isotope retention and recycling in fusion reactor plasma-facing components;Causey;J. Nucl. Mater.,2002

3. High performance blanket for ARIES-AT power plant;Raffray;Fusion Eng. Des.,2001

4. Microstructural and mechanical characterization of W/SiC bonding for structural material in fusion;Kishimoto;J. Nucl. Mater.,2011

5. Effect of 10MW/m2 plasma exposure on W–SiC/SiC dual layer tiles;Mohrez;Fusion Eng. Des.,2013

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal property and microstructural characterization of W/SiC clad plates;Fusion Engineering and Design;2017-12

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