Development of a copper alloy to beryllium HIP bonding technology for the ITER first wall-Reference-Cited by-同舟云学术

Development of a copper alloy to beryllium HIP bonding technology for the ITER first wall

Published:2005-11 Issue: Volume:75-79 Page:377-381
ISSN:0920-3796
Container-title:Fusion Engineering and Design
language:en
Short-container-title:Fusion Engineering and Design

Author:

Sherlock P.,Peacock A.T.,Mc Callum A.D.

Publisher

Elsevier BV

Subject

Mechanical Engineering,General Materials Science,Nuclear Energy and Engineering,Civil and Structural Engineering

Reference4 articles.

1. The thermophysical and mechanical properties of the copper heatsink material intended for use in ITER;Preston;Fusion Eng. Des.,2003

2. Application of a diffusion bonding methodology to develop a Be/Cu HIP bond suitable for the ITER blanket;Sherlock;Fusion Eng. Des.,2003

3. P. Lorenzetto, B. Boireau, C. Boudot, P.H. Bucci, A. Furmanek, K. Ioki, et al. Manufacture of blanket shield modules for ITER, 23rd SOFT 2004, this conference.

4. ITER Material Properties Handbook, Version 6, ITER document No. G 74 MA 4 98-06-28 R0. 1, June 1998.

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Physical and Mechanical Properties of Copper and Copper Alloys;Comprehensive Nuclear Materials;2012

2. Evaluation of Cu as an interlayer in Be/F82H diffusion bonds for ITER TBM;Journal of Nuclear Materials;2011-10

3. Manufacturing issues for the production of beryllium clad prototype components for ITER;Fusion Engineering and Design;2009-06

4. High Strength Diffusion Bonding of Beryllium to CuCrZr for ITER Applications;2009

5. Consolidation of HIP bonding technologies for the ITER first wall panels;Fusion Engineering and Design;2007-10