BIEM solution of piezoelectric cracked finite solids under time-harmonic loading
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,Computational Mathematics,General Engineering,Analysis
Reference31 articles.
1. Anti-plane vibration of cracked piezoelectric materials;Chen;Mech Res Commun,1998
2. Dynamic analysis of a cracked piezoelectric material;Shindo,1990
3. Dynamic anti-plane shear of a cracked piezoelectric ceramics;Narita;Theor Appl Mech,1998
4. Effect of electromechanical coupling on the dynamic interaction of cracks in piezoelectric materials;Wang;Acta Mech,2000
5. Modeling and analysis of the dynamic behavior of piezoelectric materials containing interacting cracks;Wang;Mech Mater,2000
Cited by 24 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Homogenization-Based Mechanical Behavior Modeling of Composites Using Mean Green Operators for Infinite Inclusion Patterns or Networks Possibly Co-continuous with a Matrix;Advanced Structured Materials;2020-11-02
2. Dynamic fracture of a nano-cracked finite exponentially inhomogeneous piezoelectric solid;Archive of Applied Mechanics;2019-01-02
3. Multiple interfacial cracks in dissimilar piezoelectric layers under time harmonic loadings;Fatigue & Fracture of Engineering Materials & Structures;2018-10-14
4. Dynamic crack analysis in piezoelectric solids under time-harmonic loadings with a symmetric Galerkin boundary element method;Engineering Analysis with Boundary Elements;2017-11
5. Interfacial dynamic impermeable cracks analysis in dissimilar piezoelectric materials under coupled electromechanical loading with the extended finite element method;International Journal of Solids and Structures;2015-08
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3