Aluminum-assisted joining of beryllium to copper for fusion applications-Reference-Cited by-同舟云学术

Aluminum-assisted joining of beryllium to copper for fusion applications

Published:1997-09 Issue:2 Volume:37 Page:287-298
ISSN:0920-3796
Container-title:Fusion Engineering and Design
language:en
Short-container-title:Fusion Engineering and Design

Author:

Cadden C.H,Odegard B.C

Publisher

Elsevier BV

Subject

Mechanical Engineering,General Materials Science,Nuclear Energy and Engineering,Civil and Structural Engineering

Reference9 articles.

1. D.E. Dombrowski, D. Hashiguchi, Bonding Beryllium to CuCrZr using Hot Isostatic Pressing, TR-1011, JET Final Report, JDO/14691, 1990.

2. D. Hashiguchi, Bonding Beryllium Layer to Copper Substrate, TR-1000, JET Final Report, JD9/13197, 1990.

3. H. Altmann, E.B. Desknis, C. Ibbott, C. Sborchia, R. Tiveyt, R. Viola, An Analysis of Induction Brazed Beryllium on Copper Alloy Substrates, Proceedings 15th IEEE Symposium on Fusion Engineering, Hyannis, MA, USA, Oct. 1993, pp. 187-191.

4. T.B. Massalski, Binary Alloy Phase Diagrams, ASM International, Materials Park, Ohio, 1987.

5. H. Kawamura, M. Kato, Reactivity Test Between Beryllium and Copper, in: Proceedings 2nd IEA International Workshop on Beryllium Technology for Fusion, September 6-8, 1995, Jackson Lake Lodge, WY, pp. 204-211.

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