Determination of three orthogonal displacement components from one double exposure hologram

Author:

Boone P.M.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. Hologram interferometry: surface displacement fringe analysis as an approach to the study of the mechanical strains and other applications to the determination of anisotropy in transparent objects;Vienot,1968

2. Formation and localisation of holographically produced interference fringes;Tsurata,1968

3. Measurement of in-plane surface strain by hologram interferometry;Ennos;J. Sci. Instrum. Series 2,1968

4. Engineering uses of holography conference;Butters,1968

5. In-plane strain measurements by a three-beam holographic method;Luxmoore;Besancon Symposium,1970

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1. Nanoscale deformation measurement by using the hybrid method of gray-level and holographic interferometry;Optics and Lasers in Engineering;2006-01

2. The application of two-refractive-index contouring on the contour difference of two compared specimens;Journal of Nondestructive Evaluation;1996-03

3. Doubly-exposed hologram with two orthogonal orientations;Pure and Applied Optics: Journal of the European Optical Society Part A;1994-05

4. Holographic, speckle and moiré techniques in optical metrology;Progress in Quantum Electronics;1993-01

5. Holographic Interferometry;Holographic Interferometry in Experimental Mechanics;1991

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